AI55912-P

* Infineon CYW55912 Wi-Fi + Bluetooth LE 5.4 Connected MCU(Combo) Solution
* Intended for Bluetooth specification BT5.4
* Intended for FCC, IC, CE, Telec (MIC), KC, SRRC, NCC, RCM, WPC
* MCU Subsystem: Arm® Cortex®-M33 192 MHz with Trustzone Cryptocell 312
* Radio Subsystem: Wi-Fi CPU Arm® Cortex® R4
* 768 KB embedded SRAM
* Dimension: 13.6 x 22.0 x 2.3mm (0.54 × 0.87 × 0.09 inches)
* Up to 48 GPIO
* PCB Antenna
* Wi-Fi Max Tx Power: +24 dBm (2.4GHz) / +22.5 dBm (5GHz)
* Wi-Fi PHY Data Rate: 143 Mbps
* Bluetooth Max Tx Power: +19 dBm
* Interfaces: SMIF, gSPI, SPI, SDIO, UART, I2C, I2S, PDM, PWM, TDM, ADC
* Operating temperature: -40 to +85°C
* High-performance Combo module ideally suited for robust/industrial-level embedded systems, IoT devices, and low-power Wi-Fi + Bluetooth applications.
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Key Features

  • Infineon CYW55912 Wi-Fi + Bluetooth LE 5.4 Connected MCU(Combo) Solution
  • Integrated 192 MHz Arm® Cortex®-M33 MCU with 768 KB RAM and 2 MB ROM
  • Dual-Band Wi-Fi 6 (2.4 GHz / 5 GHz) with up to 143 Mbps PHY data rate
  • Bluetooth® LE 5.4 with Long Range (LE Coded PHY), 2 Mbps PHY, PAST, LE Power Control, and LE Isochronous Channels
  • High RF Performance
    • Wi-Fi TX Power: up to +24 dBm (2.4 GHz) / +22.5 dBm (5 GHz)
    • Bluetooth LE TX Power: up to +19 dBm
    • Wi-Fi RX Sensitivity: down to –101.5 dBm
  • Wi-Fi 6 Technologies: OFDMA, MU-MIMO, TWT, BSS Coloring
  • Rich Peripheral Interfaces: GPIO, UART, I2C, SPI, gSPI, SDIO, SMIF, I2S, PCM, TDM, PDM, PWM, ADC
  • Audio Support: I2S, PCM, TDM, Digital Microphone (PDM)
  • Industrial Operating Temperature: –40°C to +85°C
  • Advanced Security: TrustZone®, CryptoCell® 312, Secure Boot, WPA2/WPA3, Firmware Authentication & Encryption
Specification:                                                                                   
[CYW55912] AI55912-P Preliminary Spec (Ver.0.7)

Design Guide includes

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